TSMC 3D-Stacked CPO
Canonical Summary
TSMC states 200 Gbs optical modulation and greater than 99% 3D stacking yield on CPO samples.
Lead Organization
TSMC
Key Technical Metric
200 Gbs modulation
Maturity / Status
Engineering samples
Governance / License
TSMC technology page
Technical Specifications
Modulation 200 gigabits per second (Gbs) optical signal modulation
Stacking yield Greater than 99% 3D stacking yield on engineering samples
Process 65nm silicon photonics in volume production
CPO role stated Critical for supporting data rates of over 50 terabytes per second (Tbs)
Integration 3D stacking of silicon photonics with HPC
Verification: reported · Retrieved: 2026-10-19 ·
Primary Source Reference